Μαύρο δίσκο συστατικών MPPO ESD 7.62mm πάχος για συσκευές BGA IC

Εμφάνιση δείγματος
June 12, 2024
Category Connection: Δίσκοι μητρών JEDEC
Brief: Discover the Black MPPO ESD Component Tray, 7.62mm thick, designed for BGA IC Devices. Secure, stackable, and fully traceable, this JEDEC tray streamlines logistics in fast-paced manufacturing environments. Ideal for various IC packaging solutions.
Related Product Features:
  • Black MPPO ESD Component Tray with 7.62mm thickness for BGA IC Devices.
  • Standard JEDEC tray dimensions: 12.7 inches by 5.35 inches (322.6 mm x 135.89 mm).
  • Customizable for various IC packaging methods including BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, and SiP.
  • Made from MPPO material with surface resistance of 1.0x10e4-1.0x10e11Ω.
  • Flatness maximum of 0.76mm for precise component placement.
  • ISO certified and RoHS compliant for quality assurance.
  • Suitable for electronic components, semiconductors, and embedded systems.
  • Available for OEM and ODM services with short delivery times.
Ερωτήσεις:
  • Are you a manufacturer?
    Yes, we have an ISO 9000 Quality Management System.
  • What information should we supply if we want a quotation?
    Drawing of your IC or component, Quantity, and size normally.
  • How long could you prepare samples?
    Normally, 3 days. If customized, open a new mold 25~30 days around.
  • How about batch order production?
    Normally, 5-8 days or so.
  • Do you inspect the finished products?
    Yes, we will inspect according to the ISO 9000 standard and be ruled by our QC staff.
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