Προσαρμοσμένη υποστήριξη MPPO Αντιστατικό Jedec IC Δίσκο για ηλεκτρονικά εξαρτήματα ESD PCBA

Brief: Discover the Temperature Resistance Hard ESD Tray for PCB, a reusable anti-static 7.62mm IC chip tray designed for secure transport of electronic components. Custom-fitted to your IC's footprint, this JEDEC matrix tray ensures precise component positioning, durability, and static protection for high-reliability electronics manufacturing.
Related Product Features:
  • Built to JEDEC matrix specifications for universal compatibility with tray handling and test systems.
  • High-performance ESD protection with stable conductive materials to prevent electrostatic discharge.
  • Dimensional stability in each pocket ensures secure fit and minimizes component shifting.
  • Automation-optimized structure with vacuum pickup zones and mechanical orientation guides.
  • Strong stackability with interlocking tray edges to maintain alignment and prevent slippage.
  • Operational stability under temperature variations and high-cycle usage environments.
  • Customizable pocket design, color, and edge profiles to meet unique part requirements.
  • Widely used in semiconductor fabrication, SMT lines, testing facilities, and module assembly.
Ερωτήσεις:
  • What materials are used in the Temperature Resistance Hard ESD Tray?
    The tray is made from materials like MPPO, PPE, ABS, PEI, and IDP, ensuring durability and ESD protection.
  • Can the tray be customized for non-standard component shapes?
    Yes, the tray can be customized with unique pocket designs, colors, and edge profiles to accommodate specific component requirements.
  • How does the tray ensure ESD protection during transport?
    The tray is composed of materials with stable conductive properties, providing consistent protection against electrostatic discharge.
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