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Bare Die Tray with Dimensions of 101.6x101.6x4.50 for Semiconductor and IC

Bare Die Tray with Dimensions of 101.6x101.6x4.50 for Semiconductor and IC

Ονομασία μάρκας: Hiner-pack
Αριθμός μοντέλου: HN25031
MOQ: 1000 Pcs
τιμή: $0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities)
Όροι πληρωμής: T/T
Ικανότητα εφοδιασμού: 4000PCS~5000PCS/per Day
Λεπτομέρειες
Τόπος καταγωγής:
Shenzhen, Κίνα
Πιστοποίηση:
ISO 9001 ROHS SGS
Κεπάκι και κολιέ:
Προαιρετικός
Επιφανειακή αντίσταση:
1.0x10E4~1.0x10E11Ω
Ομαλότητα:
<0>
Χρήση:
Μεταφορά, αποθήκευση, συσκευασία
Στοίβαξ:
Ναί
Σχήμα:
Ορθογώνιος
Προαιρετικός:
Κάλυψη/Κάλυψη και Κλιπ/Κλαμπ
Μούχλα έγχυσης:
Ημερομηνία εκτέλεσης 20~25 ημέρες
Packaging Details:
It Depends On The QTY Of Order And Size Of Product
Supply Ability:
4000PCS~5000PCS/per Day
Επισημαίνω:

Bare Die Tray 101.6x101.6x4.50

,

Semiconductor Bare Die Tray

,

IC Bare Die Tray with warranty

Περιγραφή του προϊόντος

Product Description:


As a core supplier in the field of semiconductor packaging and testing, our company has independently developed the Bare die trays series, specifically designed to meet the high-precision semiconductor manufacturing requirements. Relying on the global trend of miniaturization and high integration in the semiconductor industry, we have gained deep insights into the stringent market requirements for chip carriers and have formed a complete product line covering full-size chips. This product is permanently antistatic, dustproof, and wear-resistant, with extremely high dimensional accuracy. It provides good protection for the products during repeated transportation and use, ensuring long-lasting and stable product performance.

Technical Parameters:

Technical Parameter Description
Customizable Yes
Custom Logo Available
Durability Sturdy And Impact-Resistant
Heat Resistant Yes
Flatness <0.3mm
Lid And Clip Optional
Shape Rectangular
Stackable Yes
Surface Resistance 1.0x10E4~1.0x10E11Ω
Use Transport, Storage, Packing

Applications:

I. Semiconductor Packaging

Bare die tray can be used to store and protect bare chips, ensuring they are not contaminated or damaged during transportation, handling, and packaging processes.

II. Chip Testing

During the chip testing phase, using a bare die tray can ensure the chip remains stable during the testing process, improving the accuracy and reliability of the tests.

III. Storage and Distribution

Using a bare die tray can ensure chips remain clean, organized, and secure during storage and distribution, reducing the risk of damage and loss.


Customization:

Product Customization Services for IC Die Carriers - Bare Die Tray

Brand Name: Hiner-pack

Model Number: HN25031

Place Of Origin: Shenzhen, China

Certification: ISO 9001 ROHS SGS

Packaging Details: It Depends On The QTY Of Order And Size Of Product

Payment Terms: T/T

Custom Logo: Available

Shape: Rectangular

Design: Standard And Non-standard

Surface Resistance: 1.0x10E4~1.0x10E11Ω

Stackable: Yes


FAQ:

Q:Can this product specify a freight forwarder?

A:Absolutely, it's entirely up to you.

Q:Is there any discount for large orders?

A:Yes. The specific discount price will be negotiated based on the size of your order.