Chip Carrier JEDEC Tray With Custom Molded For Secure IC Transport And Storage

Chip Carrier JEDEC Tray With Custom Molded For Secure IC Transport And Storage

This JEDEC matrix tray provides dependable protection and orderly presentation for electronic components across manufacturing and logistics workflows. Manufactured from ESD-safe polymer with stable mechanical properties, the tray maintains consistent pocket geometry and reliable part retention through repeated handling. Built-in orientation markers and standardized pickup zones make setup straightforward on automated lines. Designed to reduce handling stress and part movement, the tray helps sustain yield and reduces rejects by protecting delicate components during transfer, testing, and storage.

Multiple compounds and/or powders are mixed together during the molding process to add specific features such as color, ESD properties, dimensional stability and maximum temperature ratings.

Features & Benefits:

Standardized Compatibility: Conforms to JEDEC outline conventions to ensure plug-and-play compatibility with feeders, conveyors, and tray-handling equipment.

ESD Protection: Conductive resin composition provides continuous electrostatic discharge control, protecting sensitive devices without additional treatments.

Secure Pocket Retention: Precisely formed pockets hold parts in place to minimize rocking or shifting during transport and robotic handling.

Automation-Friendly Features: Includes vacuum pickup recesses, chamfered corner indicators, and asymmetrical tabs for reliable orientation and rapid processing.

Durable & Repeatable: Engineered to withstand repeated stacking, transfer, and exposure to common process environments with minimal dimensional change.

Stack Integrity: Interlocking perimeter geometry stabilizes stacked trays to prevent slippage and protect components during storage and transit.

Technical Parameters:

Applications:

Ideal for use in assembly lines, test cells, and distribution centers, this tray supports component staging for pick-and-place machines, inspection stations, and bake ovens. It is suitable for a wide array of semiconductor and precision electronic parts used in consumer electronics, telecommunications, automotive modules, and industrial devices. The tray’s consistent presentation aids automated vision systems, robotic pickers, and manual operators alike, improving throughput and reducing setup errors.

Customization:

Multiple customization options are available to tailor the tray to your process and parts:

Pocket Geometry Modifications: Adjust pocket profiles, add retention ribs or secondary support features to secure unusual shapes or fragile parts.

Color Options: Select from several color compounds to assist with line segregation, product family identification, or QA staging.

Molded Identification: Integrate permanent, raised identifiers such as codes or part references directly into the tray during molding for durable traceability.

Automation Interface Tweaks: Add or modify locating slots, alignment pins, or cutouts to improve compatibility with specific robotic or feeder systems.