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Standard JEDEC IC Tray For AI semiconductor manufacturing progress

Standard JEDEC IC Tray For AI semiconductor manufacturing progress

Ονομασία μάρκας: Hiner-pack
Αριθμός μοντέλου: HN23072
MOQ: 500 τεμ
τιμή: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Όροι πληρωμής: 100% προκαταβολή
Ικανότητα εφοδιασμού: 2000 τμχ/ημέρα
Λεπτομέρειες
Τόπος καταγωγής:
Κίνα
Πιστοποίηση:
RoHS、ISO
Μήτρα:
4×13=52 ΤΕΜ
Ανθεκτικότητα υγρασίας:
Έως και 90%
Μέγεθος κοιλότητας:
21,18x16,08x2,6mm
Χωρητικότητα βάρους:
Ποικίλλει, τυπικά έως 500 γραμμάρια ανά κοιλότητα
Αντοχή στην υπεριώδη ακτινοβολία:
Ναί
Warpage:
Λιγότερο από 0,76 mm
Επαναχρησιμοποίηση:
Επαναχρησιμοποιήσιμο
Εφαρμογή:
IC Χειρισμός, αποθήκευση και αποστολή
Συσκευασία λεπτομέρειες:
70~100pcs/καταθήκη ((Σύμφωνα με τη ζήτηση του πελάτη)
Δυνατότητα προσφοράς:
2000 τμχ/ημέρα
Περιγραφή του προϊόντος
Standard JEDEC IC Tray For AI semiconductor manufacturing progress
This JEDEC-compliant matrix tray is tailored for manufacturers who require high-performance handling solutions in precision electronics environments. Made with static-dissipative material, it delivers essential ESD protection while maintaining structural uniformity during repeated handling cycles.
Its integrated locating and alignment features support fast and accurate positioning on automated lines, while molded pockets ensure secure device containment throughout testing, assembly, and shipment. 
Key Features/ Benefits
  • Fully conforms to JEDEC outline requirements for compatibility with global processing equipment.
  • Made from conductive materials that provide consistent ESD protection, helping safeguard sensitive components. 
  • Precision-formed cells hold parts securely in fixed orientations, reducing handling errors and device shift.  
  • Designed for compatibility with vacuum pickup tools, mechanical arms, and inline feeding systems.
  • Withstands operational stress during processing and storage while retaining tray flatness and pocket integrity.  
  • Interlocking edges allow for stable, space-saving stacking, whether in-process or in storage.
Specifications
Brand Hiner-pack
Model HN23072
Material MPPO/PPE 
Package Type BGA,QFP,QFN,LGA,PGA
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×7.62 mm
Cavity Size 21.18x16.08x2.6mm
Matrix QTY 4×13=52PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Certifications RoHS, ISO
Applications
These trays are ideal for electronics manufacturing, assembly lines, cleanroom environments, and automated handling systems. Their versatility extends to acrylic tray displays and inventory management applications.
  • Engineered for IC assembly, automated inspection, and semiconductor testing
  • Ideal for operations where speed and handling precision are key.
  • From chip-level packaging to system module assembly—and integrates easily into both inline and batch-process setups.
  • Ensures reliable positioning and part safety at every stage, in a cleanroom or on a standard production floor.

Customization:

The tray’s flexible design supports a wide range of customized configurations to meet specific production challenges: 

•  Tailored Pocket Layouts: Adjust pocket size, count, or spacing to match non-standard part dimensions or shapes.  

•  Color Coding Options: Use ESD-safe materials in selected colors for identifying product types, workstations, or production phases.  

•  In-Mold Marking: Add customer-specific identifiers or tracking features during manufacturing for clear and permanent identification.  

•  Specialized Alignment Features: Modify edges or add tool-specific indexing tabs to optimize performance in proprietary handling systems.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Factory-direct manufacturer of JEDEC & IC trays
  • JEDEC compliant, automation-compatible designs
  • OEM & ODM customization supported
  • Consistent quality and stable supply
  • Trusted by global semiconductor customers