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ESD Anti-Static Waffle Pack Trays for Semiconductor IC Chips

ESD Anti-Static Waffle Pack Trays for Semiconductor IC Chips

Ονομασία μάρκας: Hiner-pack
Αριθμός μοντέλου: HN24175
MOQ: 500 ΤΕΜ
τιμή: $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities)
Όροι πληρωμής: T/T
Ικανότητα εφοδιασμού: 2000 τμχ/ημέρα
Λεπτομέρειες
Τόπος καταγωγής:
Κίνα
Πιστοποίηση:
ROHS, ISO
Βάρος δίσκων:
Ποικίλλει, τυπικά έως 500 γραμμάρια ανά κοιλότητα
Χρώμα:
Μαύρος
Διασφάλιση Ποιότητας:
Εγγύηση παράδοσης, αξιόπιστη ποιότητα
Μέγεθος γραμμής περιγράμματος:
50,7×50,7×7,4 χλστ
Μέγεθος κοιλότητας:
1,30x1,15x0,72 χλστ
Incoterms:
Exw, FOB, CIF, DDU, DDP
Τύπος μούχλα:
Ενεση
Επαναχρησιμοποιήσιμο:
Ναί
Σχήμα δίσκου:
Ορθογώνιος
Καθαρή κατηγορία:
Γενικός και υπερηχητικός καθαρισμός
Τύπος Ic:
BGA,QFP,QFN,LGA,PGA
Επίπεδο συσκευασίας:
Πακέτο μεταφοράς
Warpage:
Στρεβλότητα MAX 0,2mm
Ικανότητα:
17x18=306 ΤΕΜ
Συσκευασία λεπτομέρειες:
χαρτοκιβώτιο, παλέτα
Δυνατότητα προσφοράς:
2000 τμχ/ημέρα
Περιγραφή του προϊόντος
ESD Anti-Static Waffle Pack Trays for Semiconductor IC Chips

This tray provides reliable ESD protection for IC chips. It prevents static damage and contamination during handling. Its cross-slot structure holds components securely.


It fits semiconductor testing, die sorting, and packaging processes. It works well in cleanroom and automated production environments. It withstands high temperatures up to 125℃.


It supports IC chip turnover, storage, and logistics. It offers customizable cavity sizes and layouts. Tailored designs meet diverse semiconductor packaging needs.

Key Features/ Benefits 
  • Deliver effective ESD anti-static performance
  • Withstands 125℃ high temperatures.
  • Offers secure IC chip storage.
  • Protects delicate fine pitch IC components efficiently
  • Support fully customized cavity sizes and layout designs
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24175
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.7×50.7×7.4 mm
Cavity Size 1.30x1.15x0.72 mm
Matrix QTY 17x18=306 PCS
Warpage MAX 0.2mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
It applies to semiconductor encapsulation, IC testing, die sorting, and wafer processing. It adapts to high-precision manufacturing and cleanroom operations.


It supports chip internal turnover, long-term storage, and logistics. It meets various integrated circuit processing and assembly requirements.

Packaging & Shipping/ Services
Custom cross-slot waffle tray services are available. Tailor cavity size, layout, and material for specific IC models. Create exclusive solutions to meet unique semiconductor packaging needs.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers