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ESD-Safe Reusable IC Chip Tray with Precision Cavity for Secure Semiconductor Storage

ESD-Safe Reusable IC Chip Tray with Precision Cavity for Secure Semiconductor Storage

Ονομασία μάρκας: Hiner-pack
Αριθμός μοντέλου: HN24187
MOQ: 500 ΤΕΜ
τιμή: $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities)
Όροι πληρωμής: T/T
Ικανότητα εφοδιασμού: 2000 τμχ/ημέρα
Λεπτομέρειες
Τόπος καταγωγής:
Κίνα
Πιστοποίηση:
ROHS, ISO
Βάρος δίσκων:
Ποικίλλει, τυπικά έως 500 γραμμάρια ανά κοιλότητα
Χρώμα:
Μαύρος
Διασφάλιση Ποιότητας:
Εγγύηση παράδοσης, αξιόπιστη ποιότητα
Μέγεθος γραμμής περιγράμματος:
50,8×50,8×4 χλστ
Μέγεθος κοιλότητας:
1,57x0,98x0,41 χλστ
Incoterms:
Exw, FOB, CIF, DDU, DDP
Τύπος μούχλα:
Ενεση
Επαναχρησιμοποιήσιμο:
Ναί
Σχήμα δίσκου:
Ορθογώνιος
Καθαρή κατηγορία:
Γενικός και υπερηχητικός καθαρισμός
Τύπος Ic:
BGA,QFP,QFN,LGA,PGA
Επίπεδο συσκευασίας:
Πακέτο μεταφοράς
Warpage:
Στρεβλότητα MAX 0,21mm
Ικανότητα:
10x10=100 ΤΕΜ
Συσκευασία λεπτομέρειες:
χαρτοκιβώτιο, παλέτα
Δυνατότητα προσφοράς:
2000 τμχ/ημέρα
Επισημαίνω:

ESD-Safe IC Chip Tray

,

Precision Cavity Waffle Pack Tray

,

Reusable Semiconductor Tray

Περιγραφή του προϊόντος
Secure ESD-Safe IC Chip Trays for Semiconductor Storage

Deliver precision cavity structure to hold delicate IC chips firmly, preventing shifting and electrostatic damage during handling. Built with durable material for consistent performance in industrial environments. Provide reliable ESD protection for sensitive semiconductor components. Seeking secure trays for safe chip storage?


Integrate seamlessly with automated packaging lines and cleanroom workflows. Perform steadily in chip loading, transfer, and inventory management procedures. Adapt smoothly to diverse semiconductor manufacturing scenarios.


Support fully customized cavity size and layout to match specific chip dimensions. Prioritize clean production compatibility. Deliver tailored solutions that optimize packaging efficiency and protect IC chips throughout transit.

Key Features/ Benefits 
  • Durable construction
  • Precision cavity layout
  • Durable construction
  • Protects delicate fine pitch IC components efficiently
  • ESD-safe design
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24187
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.8×50.8×4 mm
Cavity Size 1.57x0.98x0.41 mm
Matrix QTY 10x10=100 PCS
Warpage MAX 0.21mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Support semiconductor die attach, device testing, cleanroom assembly, and precision component kitting operations. Pair seamlessly with pick-and-place machines, Class 100 cleanroom environments, and ESD-controlled production lines.


Also used for finished IC inventory storage, inter-plant component transport, and international shipping of electrostatic-sensitive devices. Serve semiconductor fabs, OSATs, and global electronic component distributors.

Customized Services
Provide fully tailored solutions for ESD-safe IC waffle trays. Modify cavity dimensions, spacing, and layout to fit diverse die sizes and packaging needs.

Utilize high-performance ESD-safe material for enhanced durability. Offer prototype validation and personalized design support to optimize production and shipping workflows.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers